| 电子元件封装用导电胶的研究进展 |
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| 引用本文： | 吴海平,吴希俊. 电子元件封装用导电胶的研究进展[J]. 材料导报, 2004, 18(6): 83-85 |
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| 作者姓名： | 吴海平 吴希俊 |
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| 作者单位： | 浙江大学材料物理与微结构研究所,杭州,310027;浙江大学材料物理与微结构研究所,杭州,310027 |
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| 摘 要： | 导电胶作为微电子封装行业中使用的无铅连接材料的一种,近年来得到了广泛的重视.介绍了导电胶的组成、分类、导电机理、可靠性等方面的研究进展,以及导电胶作为传统共晶锡铅焊料的替代品所存在的优缺点.
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| 关 键 词： | 导电胶 导电机理 无铅连接 微电子组装 |
Progress in Electrically Conductive Adhesives for Electronic Packages |
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| WU Haiping WU Xijun. Progress in Electrically Conductive Adhesives for Electronic Packages[J]. Materials Review, 2004, 18(6): 83-85 |
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| Authors: | WU Haiping WU Xijun |
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| Abstract: | As one of lead-free connect materials in microelectronic packaging,more and more attention hasbeen paid on ECAs(electrically conductive adhesives)in recent years.The article introduces the advance research onthe constitution,class,conductive mechanism,reliability of ECAs;the advantages and disadvantages of ECAs as analternative to Sn/Pb solders. |
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| Keywords: | ECAs conductive mechanism lead-free connect microelectronic packaging |
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