| 微电路内部气氛含量分析与控制 |
| |
| 引用本文： | 欧昌银,李茂松,陈鹏,赵光辉,胡琼. 微电路内部气氛含量分析与控制[J]. 微电子学, 2005, 35(2): 153-156 |
| |
| 作者姓名： | 欧昌银 李茂松 陈鹏 赵光辉 胡琼 |
| |
| 作者单位： | 中国电子科技集团公司,第二十四研究所,重庆,400060 |
| |
| 摘 要： | 微电路内部水汽含量是影响器件可靠性的主要因素,水汽的控制包括粘接材料选择、清洗、密封前预烘烤、气密性焊接,等等.文章分析了微电路内部气氛的组成及来源,并根据实际案例,提出了与热应力和机械应力相关的间隙性漏气或单向漏气原理及其解决措施;给出了计算器件漏率的数学模型和内部气氛含量控制技术.
|
| 关 键 词： | 微电路 水汽含量 气密性 封装 |
| 文章编号： | 1004-3365(2005)02-0153-04 |
Analysis and Control of Vapor Content in Microcircuits |
| |
| OU Chang-yin,LI Mao-song,CHENG Peng,ZHAO Guang-hui,HU Qiong. Analysis and Control of Vapor Content in Microcircuits[J]. Microelectronics, 2005, 35(2): 153-156 |
| |
| Authors: | OU Chang-yin LI Mao-song CHENG Peng ZHAO Guang-hui HU Qiong |
| |
| Abstract: | Vapors in microcircuits are one of the major factors affecting the reliability of micro devices. The control of vapor content involves the selection of adhesives, cleaning, pre-bake before sealing, and hermetical welding.The constituents and origins of vapors inside the microcircuit are analyzed.Mechanisms for intermittent or one-way leakers associated with both thermal and mechanical stresses are proposed, along with its solutions. Mathematical model to calculate the leakage rate of devices is presented, and techniques to control vapor contents in IC packages are described. |
| |
| Keywords: | Microcircuit Vapor content Hermiticity Packaging |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
