The effect of process parameters on volatile release for a benzoxazine–epoxy RTM resin

Volatile release during cure is a potential cause of void formation during the resin transfer molding of complex thermosetting resins. In this study, a blended benzoxazine–epoxy resin system is analyzed to determine the rate at which volatiles are evolved, as well as the dependence of that rate on process parameters. The evolution of thermophysical and thermochemical resin properties is characterized using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The identity and rate of evolution of the gaseous byproducts released during cure are determined at ambient pressure using a Fourier transform infrared spectrometer (FTIR) linked to a reaction cell. The results show that gas release during cure can be reduced but not eliminated by degassing at elevated temperature. Furthermore, the results indicate that the nature and rate of volatile release can be modified by judicious selection of cure cycle, as shown by a preliminary analysis of manufactured neat resin panels.