Fabrication of a polymer composite with high thermal conductivity based on sintered silicon nitride foam |
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| Affiliation: | 1. Jiangsu Collaborative Innovation Center for Advanced Inorganic Function Composites, Nanjing Tech University, Nanjing, 210009, China;2. College of Materials Science and Engineering, Nanjing Tech University, Nanjing, 210009, China;1. Institute of Composite Materials, Key Laboratory of Superlight Material and Surface Technology of Ministry of Education, College of Materials Science and Chemical Engineering, Harbin Engineering University, Harbin 150001, China;2. UER Chimie Appliquée, Ecole Militaire Polytechnique, BP 17, Bordj El-Bahri, Algiers, Algeria |
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| Abstract: | A novel route was developed to fabricate Si3N4/epoxy composite. In this route, the Si3N4 particles were constructed into the foamed shape by using protein foaming method, firstly. Then the Si3N4 foams were sintered to bond these Si3N4 particles together. Finally, the Si3N4/epoxy composite was fabricated by infiltrating the epoxy resin solution into the sintered Si3N4 foams. This route was proved to be an efficient way in enhancing the thermal conductivity of epoxy matrix at a low loading fraction. For example, the thermal conductivity of the as-prepared Si3N4/epoxy composite with a loading fraction of 22.2 vol% was up to 3.89 W m−1 K−1, which was about 17 times higher than that of neat epoxy. |
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| Keywords: | A. Polymer-matrix composites (PMCs) A. 3-Dimensional reinforcement B. Thermal properties Silicon nitride foams |
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