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Thermal conductivity of aligned CNT/polymer composites using mesoscopic simulation
Affiliation:1. State Key Laboratory of Digital Manufacturing Equipment and Technology and School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, Hubei, People’s Republic of China;2. State Key Laboratory of Materials Processing and Die and Mould Technology and School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, Hubei, People’s Republic of China;3. School of Materials Science and Engineering, Wuhan Institute of Technology, Wuhan 430073, Hubei, People’s Republic of China;4. Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson, TX 75080, United States;1. State Key Laboratory of Material Processing and Die and Mould Technology and School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, Hubei, People’s Republic of China;2. State Key Laboratory of Digital Manufacturing Equipment and Technology and School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, Hubei, People’s Republic of China;3. Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson, TX 75080, USA;1. Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China;2. College of Materials Science and Engineering, Shenzhen University, Shenzhen 518060, China;3. State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240, China;4. Department of Electronics Engineering, The Chinese University of Hong Kong, 999077, Hong Kong, China;5. School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332, United States;1. University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, China;2. School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;1. Centre of Nanotechnology, Indian Institute of Technology Roorkee, Uttarakhand 247667, India;2. Biomaterials and Multiscale Mechanics Lab, Department of Metallurgical and Materials Engineering, Indian Institute of Technology Roorkee, Uttarakhand 247667, India;1. Dow Chemical (China) Investment Co. Ltd., Shanghai 201203, People''s Republic of China;2. The Dow Chemical Company, Midland, MI 48674, USA;3. The Dow Chemical Company, Freeport, TX 77541, USA;1. Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China;2. School of Materials Science and Engineering, Nanchang University, Nanchang, 330031, China;3. College of Materials Science and Engineering, Shenzhen University, Shenzhen, 10590, China;4. Department of Electronics Engineering, The Chinese University of Hong Kong, Hong Kong, China;5. School of Mechanical Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA, 30332, United States;6. Institute for Frontier Materials, Deakin University, Waurn Ponds, VIC, 3216, Australia
Abstract:Thermal conductivity of CNT/polymer composites depends on alignment, dispersion, volume fraction and size of CNTs as well as polymer size. By coupling smoothed particle hydrodynamics and dissipative particle dynamics, thermal conductivities of random and aligned composites along with their meso morphologies are studied in detail. Thermal conductivity along the alignment of CNT can be significantly enhanced to 16 times that of polymer by increasing volume fraction, dispersion degree and length of CNT, meanwhile thermal conductivity perpendicular to the alignment of CNT is affected modestly by these factors. Enhancement of thermal conductivity of random composites could only be efficiently achieved by increasing the volume fraction of CNT. Particularly, thermal conductivity κ is proportional to the square of volume fraction of CNT v in well dispersed random and aligned composites, i.e. κv2.
Keywords:Thermal conductivity  Carbon nanotube  Polymer composites  Smoothed particle hydrodynamics  Dissipative particle dynamics
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