Fluorographene/polyimide composite films: Mechanical,electrical, hydrophobic,thermal and low dielectric properties |
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| Affiliation: | 1. School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, People’s Republic of China;2. School of Chemical Engineering and Technology, Harbin Institute of Technology, Harbin 150001, People’s Republic of China;3. Center for Composite Materials and Structures, Harbin Institute of Technology, Harbin 150001, People’s Republic of China;4. Heilongjiang Institutes of Science and Technology, Harbin 150027, People’s Republic of China;1. School of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China;2. Key Laboratory of Engineering Dielectrics and its Application Ministry of Education, Harbin University of Science and Technology, Harbin 150040, China;1. DuPont Company, 800 DuPont Road, Circleville, Ohio, 43147, United States;2. European Patent Office, Munich, 80298, Germany;3. University of Connecticut, Institute of Materials Science, Polymer Science Program, 97 North Eagleville Road, Storrs, CT, 06269-3136, United States |
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| Abstract: | Nowadays, dielectric materials with excellent mechanical and hydrophobic properties are desired for use in the integrated circuits (ICs). For this reason, low dielectric constant fluorographene/polyimide (FG/PI) composite films were prepared by a facile solution blending method, suggesting that the mechanical, electrical, hydrophobic and thermal properties were significantly enhanced in the presence of FG. With addition of 1 wt% FG, the tensile strength, Young’s modulus and elongation at break were dramatically increased by 139%, 33% and 18% respectively when compared with pure PI film. Furthermore, composite films exhibit superior hydrophobic and thermal stability performance. Especially, the FG/PI film with 0.5 wt% of FG possessing a low dielectric constant of 2.48 and a good electrical insulativity that is lower than 10?14 S m?1. Therefore, by their excellent performance, FG/PI hybrid films represent suitable candidate solutions with applications in the microelectronics and aerospace industries. |
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| Keywords: | A Polymer-matrix composites (PMCs) B Thin films C Electrical properties D Mechanical properties |
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