Ion-beam mixed ultra-thin cobalt suicide (CoSi2) films by cobalt sputtering and rapid thermal annealing |
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Authors: | S Kal I Kasko H Ryssel |
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Affiliation: | (1) Department of Electronics & Elect. Comm. Engineering, Indian Institute of Technology, 721302 Kharagpur, India;(2) Lehrstuhl fur Electronische Bauelemente, Universitat Erlangen-Nurnberg, Cauerstrasse 6, D-91058 Erlangen, Germany |
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Abstract: | The influence of ion-beam mixing on ultra-thin cobalt silicide (CoSi2) formation was investigated by characterizing the ion-beam mixed and unmixed CoSi2 films. A Ge+ ion-implantation through the Co film prior to silicidation causes an interface mixing of the cobalt film with the silicon
substrate and results in improved silicide-to-silicon interface roughness. Rapid thermal annealing was used to form Ge+ ion mixed and unmixed thin CoSi2 layer from 10 nm sputter deposited Co film. The silicide films were characterized by secondary neutral mass spectroscopy,
x-ray diffraction, tunneling electron microscopy (TEM), Rutherford backscattering, and sheet resistance measurements. The
experi-mental results indicate that the final rapid thermal annealing temperature should not exceed 800°C for thin (<50 nm)
CoSi2 preparation. A comparison of the plan-view and cross-section TEM micrographs of the ion-beam mixed and unmixed CoSi2 films reveals that Ge+ ion mixing (45 keV, 1 × 1015 cm−2) produces homogeneous silicide with smooth silicide-to-silicon interface. |
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Keywords: | Cobalt silicide ion-beam mixing rapid thermal anneal |
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