| 引线带楔焊键合技术 |
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| 引用本文： | 郭大琪.引线带楔焊键合技术[J].电子与封装,2006,6(12):8-10. |
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| 作者姓名： | 郭大琪 |
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| 作者单位： | 中电科技集团公司第58研究所,江苏,无锡,214035 |
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| 摘 要： | 引线带楔焊键合和引线(圆形)楔焊键合是不同的。对于高频器件应用来说,引线带键合较之于圆形引线键合更为有利。为了让更多的人了解该项技术,文章对部分相关技术,其中包括键合工艺过程、键合引线的断丝方式、键合引线带规格以及键合劈刀的选择作了介绍。
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| 关 键 词： | 引线带键合 线夹扯线 工作台扯线 劈刀结构 |
| 文章编号： | 1681-1070（2006）12-0008-03 |
| 收稿时间： | 2006-06-06 |
| 修稿时间： | 2006-06-06 |
Ribbon Wire Bonding Technology |
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| GUO Da-qi.Ribbon Wire Bonding Technology[J].Electronics & Packaging,2006,6(12):8-10. |
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| Authors: | GUO Da-qi |
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| Affiliation: | China Electronic Technology Group Corporation No,58 Research Institute, Wuxi 214035, China |
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| Abstract: | Ribbon wire bonding is different from conventional wire bonding technology, One advantage of ribbon over round wire is that its high frequency impedance is lower which reduces both the inductance and the skin-effect losses. As such, it is often used in microwave devices, The ribbon wire bonding procedure, different wire break off modes, wire specifications and the choosing method of wedge tool are discussed in considerable detail in the article. |
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| Keywords: | ribbon wire bonding wire clamp break off working table break off structure of wedge tool |
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