Characterization of Si homoepitaxial films grown with and without surface photoactivation by ArF excimer laser-induced photodissociation of Si2H6

Silicon homoepitaxial films have been grown by photodissociation of Si₂H₆ by the 193 nm line of an ArF excimer laser in an ultra-high vacuum system. Silicon epitaxy has been achieved in two ways: one, in which the laser shines into the chamber parallel to the substrate and another, in which the laser is directly incident on the substrate at grazing angles (87° with respect to the substrate normal). Controllable growth rates of 0.5–4Å/min have been achieved for crystalline films by the first method using substrate temperatures as low as 250° C, Si₂H₆ partial pressures of 20 mTorr and photon flux densities of 10¹⁶ photons/pulse.cm². In the second method, where the laser beam is directly incident on the wafer at grazing angles, very high growth rates of up to 80Å/min have been achieved at 300° C, 20 mTorr Si₂H₆ partial pressure and a photon flux density of 2 × 10¹⁵ photons/pulse.cm². A comparison of the microstructure of the films grown by the two methods is presented on the basis ofin situ reflection high energy electron diffraction (RHEED) analysis and selected area transmission electron microscopy (TEM) studies. In both cases, the growth rates are found to be linearly dependent on the photon flux density for the process parameter ranges studied.