3D Integration for Introspection |
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| Authors: | Shashidhar Mysore Banit Agrawal Navin Srivastava Lin S-C Kaustav Banerjee Sherwood T |
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| Affiliation: | Dept. of Comput. Sci., California Univ., Santa Barbara, CA; |
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| Abstract: | In today's complex processors, specialized profiling and introspection hardware would be incredibly beneficial to software developers, but most proposals for its addition would increase the cost of every die manufactured. Modular, "snap-on" analysis hardware, stacked vertically with the processor die using a 3D interconnect, could be included with developer systems to assist in debugging and testing, and omitted from consumer systems to keep them economically competitive |
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