| 化学镀锡在印刷线路板制备中的应用 |
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| 引用本文： | 赵杰,李宁.化学镀锡在印刷线路板制备中的应用[J].电镀与环保,2006,26(1):1-5. |
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| 作者姓名： | 赵杰 李宁 |
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| 作者单位： | 哈尔滨工业大学,应用化学系,黑龙江,哈尔滨,150001;哈尔滨工业大学,应用化学系,黑龙江,哈尔滨,150001 |
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| 摘 要： | 从化学镀锡液的基本组成、工艺特点、反应过程及应用等几方面简述了近年来化学镀锡在印刷线路板制备中的研究进展.概括了目前化学镀锡工艺存在的问题,对镀锡过程中出现沉积速率低、锡面易变色、锡须和渗镀等现象进行了详细的讨论,总结了问题出现的原因及解决的方法.同时对化学镀锡的研究方向和发展趋势进行展望.
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| 关 键 词： | 化学镀锡 厚度 锡面变色 锡须 |
| 文章编号： | 1000-4742（2006）01-0001-05 |
| 收稿时间： | 2005-08-08 |
| 修稿时间： | 2005年8月8日 |
Application of Electroless Tin in Fabrication of Printed Circuit Boards |
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| ZHAO Jie,LI Ning.Application of Electroless Tin in Fabrication of Printed Circuit Boards[J].Electroplating & Pollution Control,2006,26(1):1-5. |
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| Authors: | ZHAO Jie LI Ning |
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| Affiliation: | Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001 |
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| Abstract: | The compositions and controlling conditions of the bath, depositing mechanism and applications of electroless tin in fabrication of printed circuit boards in recent years are reviewed. Present problems of electroless tin plating are described in detail, which include low deposition rate, tarnish, tin whisker and easily etched by the plating solution. The causes and solutions for these problems are summarized. The research tendency and developing prospect of electroless tin plating are also discussed. |
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| Keywords: | electroless tin plating thickness tarnish of tin coating tin whisker |
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