| (SiC)p表面修饰和表征及动力学分析 |
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| 引用本文： | 宿辉,杨春艳,尉法兵,曹茂盛.(SiC)p表面修饰和表征及动力学分析[J].化工新型材料,2007,35(8):38-39. |
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| 作者姓名： | 宿辉 杨春艳 尉法兵 曹茂盛 |
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| 作者单位： | 黑龙江工程学院材料与化学工程系,哈尔滨,150050;北京理工大学材料科学与工程学院,北京,100081 |
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| 基金项目： | 黑龙江省科技攻关项目
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黑龙江省教育厅骨干项目
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学院优秀青年基金 |
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| 摘 要： | 利用简单的化学镀技术,通过改进前处理工艺,对(SiC)p进行低成本的表面修饰,获得了镀层连续,无光滑(SiC)p裸露的较高质量的改性碳化硅复合粉体简写为(Ni/SiC)p].SEM、EDS、XRD测试结果表明,修饰后的(Ni/SiC)p较修饰前的(SiC)p导电性提高,形貌、组成、结构发生改变.同时对(SiC)p表面修饰的动力学机理给出初步分析,并尝试给出该过程的碰撞速率方程.
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| 关 键 词： | (SiC)p 表面修饰 化学镀 动力学 |
| 修稿时间： | 2007年4月26日 |
Surface decoration characterizations and kinetics analysis on (SiC)p |
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| Xu Hui,Yan Chunyan,Wei Fabing,Cao Maosheng.Surface decoration characterizations and kinetics analysis on (SiC)p[J].New Chemical Materials,2007,35(8):38-39. |
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| Authors: | Xu Hui Yan Chunyan Wei Fabing Cao Maosheng |
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| Abstract: | Surface of(SiC)p was decorated at low cost by simple electroless plating,improved the technology of pre-treatments and produce continual,non-lubricous and high quality decoration of(SiC)Pabbreviate as(Ni/SiC)P].Experiment results of SEM,EDS,XRD indicated that the electric functions of(Ni/SiC)P was much higher than those of unembellished(SiC)P,in respect of form,facial look and structure changed.It's also analyzed that the(SiC)P surface decoration kinetics principium,presented that(SiC)P surface decoration collide velocity equation, |
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| Keywords: | (SiC)P surface decoration electroless plating kinetics |
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