Al-5．8Mg—Mn-Sc—Zr合金的再结晶行为

采用活性熔剂保护熔炼，水冷铜模激冷铸造技术制备了Al-5.8Mg-0.4Mn-0.25Sc-0.1Zr（质量分数，%）合金板材。通过显微硬度测试、光学显微镜和透射电镜观察等分析手段研究了该合金的再结晶温度和再结晶形核机制。结果表明：通过添加微量的Sc和Zr元素使Al-Mg-Mn合金的抗再结晶能力得到显著提高，即添加了Sc和Zr的Al-Mg-Mn合金再结晶温度（450℃）比没有添加的合金（150℃）的高。Al-Mg-Mn-Sc-Zr合金的再结晶温度较高的主要原因是细小、弥散的Al 3（Sc,Zr）粒子对位错和亚晶界的钉扎作用。合金的再结晶形核机制为亚晶合并和亚晶长大的双重机制。

Recrystallization ofAl-5.8Mg-Mn-Sc-Zr alloy

Al-5.8Mg-0.4Mn-0.25Sc-0.1Zr （mass fraction, %） alloys were prepared by water chilling copper mould ingot metallurgy processing which was protected by active flux. The recrystallization temperature and nucleation mechanism of the alloy were studied by means of hardness tests, observations of optical microscopy and transmission electron microscopy. The results show that the anti-crystallization ability can be significantly improved by adding minor Sc and Zr into Al-Mg-Mn alloy. This can be proved by a much higher recrystalliztion temperature （450 ~C） than Al-Mg-Mn alloy without Sc and Zr （150 ℃）. The main reason of the great increase of recrystallization temperature can be attributed to the strong pinning effect of highly disperseded Al3（Sc,Zr） particles on dislocations and sub-grain boundaries. The recrystallizing process reveals itself the nucleation mechanism of the alloy involving not only the sub-grain coalescence but also the sub-grain growth.