| 片式元件SMT焊点三维形态计算与试验测量 |
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| 引用本文： | 王国忠,王青春.片式元件SMT焊点三维形态计算与试验测量[J].电子工艺技术,1996(5):21-24. |
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| 作者姓名： | 王国忠 王青春 |
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| 作者单位： | 哈尔滨工业大学 |
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| 摘 要： | 由于ＳＭＴ中焊点形态影响焊点质量和可靠性，国外对ＳＭＴ焊点形态的预测和控制研究有所重视。文中用有限元方法对ＲＣ３２１６片式元件焊点三维形态进行计算，考虑了焊点钎料量对焊点三维形态的影响；提出了一种用触针测量法研究点三维形态的实验方法，并对计算结果和实验结果进行了比较，结果表明，计算结果与实验结果吻合良好。
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| 关 键 词： | 片式元件 表面安装技术 焊点 测量 试验 |
Calculation and experimental measurement of three-dimensional solder joint shapes of chip component in SMT |
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| Wang Guozhong,Wang Chunqing,Shao Lin,Qian Yiyu.Calculation and experimental measurement of three-dimensional solder joint shapes of chip component in SMT[J].Electronics Process Technology,1996(5):21-24. |
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| Authors: | Wang Guozhong Wang Chunqing Shao Lin Qian Yiyu |
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| Affiliation: | Wang Guozhong Wang Chunqing Shao Lin Qian Yiyu |
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| Abstract: | Solder joint shapes in Surface Mount Technology(SMT)play an important role in joint reliability,the prediction of solder joint shapes and the control of joint formation have received more attention in recent years.In this paper,the finite element method was employed to calculate the three-dimensional solder joint shapes of RC 3216 chip componeht,and the effects of solder volume on solder joint shapes were investigated.Moreover,an experimental method of touch pin measurement to analysis solder joint shapes was put forward,the results show the calculating results and the experimental results were identical well. |
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| Keywords: | SMT three-dimensional solder joint shape calculation touch pin measurement |
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