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| 利用光固化树脂作为结合剂的超薄型切割砂轮的研制 | |
| 引用本文： | 彭伟,谷 泰弘,柳原 圣.利用光固化树脂作为结合剂的超薄型切割砂轮的研制[J].中国机械工程,2000,11(7):724-726. |
| 作者姓名： | 彭伟 谷 泰弘 柳原 圣 |
| 作者单位： | 1. 浙江工业大学,杭州市,310032 2. 东京大学,日本,东京 3. 东京大学生产技术研究所 |
| 基金项目： | 1 997年度教育部优秀年轻教师基金 |
| 摘 要： | 利用光固化树脂作为结合剂研制成功厚度为０．１５ｍｍ的超薄型金刚石切割砂轮，并完成了对单昌硅片的切割试验。研究结果表明，经ＳｉＯ２微粒增强后的光固化树脂可以替代热固化树脂用作超薄型切割砂轮的结合剂，微粒添加量的大小是影响超薄型切割砂轮的机械性能和切割精度的一个重要因素。 |
| 关 键 词： | 光固化树脂 超薄型切割砂轮 结合剂 研制 |
Development of a Dicing Blade Applying Light-Solidifying Resin as Bonding Material |
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| PENG Wei.Development of a Dicing Blade Applying Light-Solidifying Resin as Bonding Material[J].China Mechanical Engineering,2000,11(7):724-726. | |
| Authors: | PENG Wei |
| Abstract: | Applying a light-solidifying resin instead of heat-solidifying resin as a bonding material, a dicing blade in thickness of 0.15 mm has been developed. Using this new kind of blade, a series of dicing experiments on silicon wafer have been completed. The results prove that the hardened resin compounded with ultra-fine silica powder can be used as bond material in dicing blade. The ratio of compounded powder is a significant parameter effected on the mechanical performance of dicing blade and the dicing precision. |
| Keywords: | dicing blade light-solidifying resin rapid prototyping grinding tool |
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