| 电沉积制备Sn-Cu无铅钎料电镀工艺的研究 |
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| 引用本文： | 王亚平,张亚辉,程应武,邓朝阳,邓晓亮,曾德长.电沉积制备Sn-Cu无铅钎料电镀工艺的研究[J].电镀与环保,2009,29(3). |
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| 作者姓名： | 王亚平 张亚辉 程应武 邓朝阳 邓晓亮 曾德长 |
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| 作者单位： | 1. 华南理工大学材料学院,广东,广州,510640
2. 武汉理工大学,资源与环境工程学院,湖北,武汉,430070 |
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| 摘 要： | Sn-Cu无铅钎料具有优良的物理化学性能,研究了以柠檬酸为配位剂的电镀液中电沉积Sn-Cu薄膜.应用SEM,EDS,XRD等仪器分析手段对镀层进行了分析、表征;根据测定的阴极极化曲线对Sn-Cu电沉积机理进行了探讨.实验结果表明:电沉积能得到由Sn和Cu6Sn5两相组成、Sn的质量分数为99%的Sn-Cu膜层.
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| 关 键 词： | 电沉积 配位剂 阴极极化曲线 |
A Study of the Plating Process for Preparing Sn-Cu Lead-Free Solders by Electrodeposition |
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| WANG Ya-ping,ZHANG Ya-hui,CHENG Ying-wu,DENG Chao-yang,DENG Xiao-liang,ZENG De-chang.A Study of the Plating Process for Preparing Sn-Cu Lead-Free Solders by Electrodeposition[J].Electroplating & Pollution Control,2009,29(3). |
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| Authors: | WANG Ya-ping ZHANG Ya-hui CHENG Ying-wu DENG Chao-yang DENG Xiao-liang ZENG De-chang |
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| Affiliation: | 1.School of Materials;South China University of Technology;Guangzhou;510640;China;2.School of Resource and Environmental Engrg.;Wuhan Univ.of Tech.;Wuhan 430070;China |
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| Abstract: | Sn-Cu lead-free solders possess excellent physical and chemical properties.Electrodeposition of tin-copper films from electrolytes with citric acid as complexant has been investigated.Scanning electron microscope(SEM),energy dispersive X-ray spectroscopy(EDS) and X-ray diffraction(XRD) were employed to analyze and characterize the deposits,and cathodic polarization curves was applied to study the electroplating mechanism.The results show that Sn-Cu films with mass fraction of 99% Sn,composed of Sn and Cu_6S... |
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| Keywords: | electrodeposition complexant cathodic polarization curve |
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