LED封装胶专用增粘剂的制备

以羟基硅油、γ-（2,3-环氧丙氧）丙基三甲氧基硅烷（KH 560）、乙烯基三甲氧基硅烷等为原料,制得LED封装胶专用增粘剂。研究了增粘剂合成工艺对聚邻苯二酰胺树脂（PPA）及金属粘接性的影响。结果表明,制备增粘剂的较佳工艺为：羟基硅油、KH 560、乙烯基三甲氧基硅烷的量之比为1.0∶1.0∶0.5,二月桂酸二丁基锡的质量分数为250×10^-6,在温度60～65℃下保温反应4 h;将此增粘剂按LED封装胶总质量的1.25%加入到B组分中配成封装胶,用于5050、5730灯架的封装测试,过3次回流焊,然后在100℃沸腾的红墨水中连续煮18 h,红墨水不渗入灯珠内杯周边及底部。

Preparation ofthe Tackifier for LED Encapsulating Materials

The tackifier for LED encapsulation was prepared with hydroxyl-terminated silicone fluid,γ-（ 2,3-epoxypropoxy） propyltrimethoxysilane（ KH 560）,vinyl trimethoxy silane,etc. as the raw materials.Effects of bonding for the tackifier on polyphosphoric acid（ PPA） and metal were investigated. Results show that the reaction was carried at a molar ratio of hydroxyl-terminated silicone fluid,KH560 and vinyl trimethoxy silane of 1. 0∶ 1. 0∶ 0. 5,at a mass fraction of dibutyltin dilaurate of 250 × 10^-6 at 130℃ for 4 hours. Then the LED encapsulating material was obtained by adding 1. 25% of the tackifier to component B. The LED encapsulating material was tested by a 5050,5730 lamp bead bracket,and then reflowed soldering for 3 times,and cooked it in 100℃ boiling red ink for 18 hours. The red ink did not penetrate the surrounding and bottom of the lamp bead.