Zn元素对Sn0.5Ag0.7Cu/Cu接头剪切性能和时效接头组织结构的影响 |
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引用本文: | 张敏,朱子越,许桓瑞,王刚,杜明科,王博玉. Zn元素对Sn0.5Ag0.7Cu/Cu接头剪切性能和时效接头组织结构的影响[J]. 焊接学报, 2021, 42(5): 57-64. DOI: 10.12073/j.hjxb.20200909002 |
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作者姓名: | 张敏 朱子越 许桓瑞 王刚 杜明科 王博玉 |
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作者单位: | 西安理工大学,西安,710048 |
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基金项目: | 国家自然科学基金资助项目(51974243);陕西省自然科学基础研究计划(2019JZ-31);西安市科技计划项目(201805037YD15CG21(16)). |
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摘 要: | 为了改善Sn0.5Ag0.7Cu/Cu接头组织结构和力学性能,通过在Sn0.5Ag0.7Cu钎料中添加Zn元素,以Sn0.5Ag0.7Cu-xZn (x=0, 0.1, 0.4, 0.7, 1)钎料合金对紫铜基板进行了熔钎焊试验,并对接头进行微观组织及力学性能分析. 结果表明,改变了接头结合界面处金属间化合物(intermetallic compound,IMC)组织结构,增强了接头剪切断裂的韧性断裂特征,提高了接头抗剪强度. 当Zn元素的加入量为0.4% (质量分数)时,接头抗剪强度达到最高的47.81 MPa. 添加Zn元素等温时效处理后,对接头中IMC层的生长有着抑制作用,并且随着时效温度的提高和时效时间的延长,脆性层Cu5Zn8会破碎直至消失,因此在改善接头结合界面处IMC组织性能的同时,不会改变其组成和结构.
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关 键 词: | 结合界面 扩散 金属间化合物 时效 |
收稿时间: | 2020-09-09 |
Effect of Zn on the shear properties of Sn0.5Ag0.7Cu/Cu joints and the microstructure of aging joints |
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Affiliation: | Xi’an University of Technology, Xi’an, 710048, China |
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Abstract: | In order to improve the microstructure and mechanical properties of the Sn0.5Ag0.7Cu/Cu joint, by adding Zn element to the Sn0.5Ag0.7Cu solder, changed the intermetallic compound (intermetallic compound, IMC) structure at the joint interface, and the joint shear is strengthened. The ductile fracture characteristics of shear fracture improve the joint shear strength.When the addition of Zn element is 0.4%, the joint shear strength reaches the highest 47.81 MPa.The solder joint of Sn0.5Ag0.7Cu-xZn(x=0, 0.1, 0.4, 0.7, 1) /Cu was studied, the result shows that the addition of Zn element has an inhibitory effect on the growth of the IMC layer in the joint after isothermal aging treatment, and with the increase of aging temperature and aging time, the brittle layer Cu5Zn8. It will break until it disappears, so it will not change its composition and structure while improving the performance of the IMC at the joint interface. |
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