Ni-CNTs增强颗粒对Sn58Bi-0.1Er焊点组织与力学性能的影响

采用真空熔炼方法制备了不同Ni-CNTs含量的Sn58Bi-0.1Er钎料合金，研究不同Ni-CNTs含量对Sn58Bi-0.1Er复合钎料在Cu 基板上的润湿性能的影响，并对不同Ni-CNTs含量下接头界面处金属间化合物的组织形貌及接头的剪切性能进行了分析. 结果表明，当Ni-CNTs 增强颗粒的添加为0.01% ~ 0.05%(质量分数)时，复合钎料合金在铜板上的润湿性得到了提高，随着Ni-CNTs含量的进一步增加，复合钎料在铜板上的润湿性开始呈下降趋势；随着Ni-CNTs的加入，Sn58Bi/Cu界面金属间化合物由锯齿状的Cu₆Sn₅转变成薄层状的(Cu, Ni)₆Sn₅, Ni-CNTs增强颗粒的加入可以有效减小界面金属间化合物层的厚度；Ni-CNTs增强颗粒的加入提高了Sn58Bi/Cu接头的剪切力，当Ni-CNTs的添加量为0.1%时，接头的剪切力最高为432.86 N，较Sn58Bi-0.1Er钎料接头的剪切力提升了两倍以上. Ni-CNTs增强颗粒的添加有效地改善了Sn58Bi-0.1Er接头的力学性能.

Effect of Ni-CNTs reinforced particles on the microstructure and mechanical properties of Sn58Bi-0.1Er solder joints

Sn58Bi-0.1Er solder alloys with different Ni-CNTs content were prepared by vacuum melting method, and the effect of different Ni-CNTs content on the wettability of Sn58Bi-0.1Er composite solder on Cu substrate were studied. The interface structure morphology of the intermetallic compound at the joint interface and shear properties under different Ni-CNTs content were analyzed. The results show that when the addition of Ni-CNTs reinforcing particles is 0.01wt% ? 0.05wt%, the wettability of the composite solder alloy on the Cu plate is improved, with the further increase of Ni-CNTs content, the wettability of the composite solder on the Cu plate began to show a downward trend. With the addition of Ni-CNTs, the Sn58Bi/Cu interface intermetallic compound transform from serrated Cu₆Sn₅ to thin layered (Cu, Ni)₆Sn₅. The addition of Ni-CNTs reinforcing particles can effectively reduce the thickness of the intermetallic compound layer. The addition of Ni-CNTs reinforced particles improves the shear force of the Sn58Bi/Cu joint. When the addition amount of Ni-CNTs is 0.1%, the maximum shear force of the joint is 432.86 N, which is more than twice the shear force of the Sn58Bi-0.1Er solder joint. The addition of Ni-CNTs reinforced particles effectively improves the mechanical properties of the Sn58Bi-0.1Er joint.