| 93W/Ni/QSn4-3扩散焊接接头的显微结构和力学性能 |
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| 引用本文： | 苏小鹏,罗国强,沈强,王传彬,张联盟.93W/Ni/QSn4-3扩散焊接接头的显微结构和力学性能[J].焊接学报,2009,30(7):61-64. |
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| 作者姓名： | 苏小鹏 罗国强 沈强 王传彬 张联盟 |
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| 作者单位： | 1. 武汉理工大学材料复合新技术国家重点实验室,武汉,430070
2. 武汉理工大学材料复合新技术国家重点实验室,武汉,430070;中国工程物理研究院流体物理研究所冲击波物理与爆轰物理实验室,四川绵阳,621900 |
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| 基金项目： | 国家自然科学基金，湖北省创新研究群体科学基金 |
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| 摘 要： | 采用扩散焊接的方法制备出加入Ni箔中间层的钨合金(93w)与锡青铜合金(QSn4-3)焊接接头样品.利用XRD,SEM和EPMA对焊接接头的物相组成和显微结构进行了分析,并测量了焊接接头样品的抗拉强度.结果表明,加镍的93W与QSn4-3进行扩散焊接时,焊接层的显微结构结合紧密,Ni与Cu元素之间以及93W合金的添加剂元素在Ni箔中分布存在明显的连续变化层.物相分析和显微硬度结果表明Ni元素与QSn4-3中的Cu元素和93W的添加剂元素的固溶反应,促进了93W,Ni/QSn4-3焊接接头强度的大幅度提高.Abstract：The 93W/Ni/QSn4-3 joint was prepared by diffusion bonding at vacuum using pure nickel foil as interface layer. The microstructure and composition were characterized by SEM and EP-MA. The tensile strength of joint was also measured. The test results show that Ni foil improves the tensile strength of 93W/Ni/QSn4-3 joint. The thickness of Ni interlayer becomes thiner obviously because of the diffusion layer between Ni element of Ni foil and W and additional elements of 93W alloy, as well as the gradient layer of Ni and Cu elements. Solution reactions between Ni element of Ni foil and Cu element of QSn4-3 alloy, W and additional elements of 93W alloy achieve the joint of 93W/Ni/QSn4-3, that is why tensile strength of 93W/Ni/QSn4-3 joint welded is improved.
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| 关 键 词： | 扩散焊接 钨合金 锡青铜 Ni箔 |
| 收稿时间： | 2008/7/1 0:00:00 |
Microstructure and mechanical property of 93W/Ni/QSn4-3 joint welded by diffusion bonding |
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| SU Xiaopeng,LUO Guoqiang,SHEN Qiang,WANG Chuanbin and ZHANG Lianmeng.Microstructure and mechanical property of 93W/Ni/QSn4-3 joint welded by diffusion bonding[J].Transactions of The China Welding Institution,2009,30(7):61-64. |
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| Authors: | SU Xiaopeng LUO Guoqiang SHEN Qiang WANG Chuanbin and ZHANG Lianmeng |
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| Affiliation: | State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China,State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China;Laboratory for Shock Wave and Detonation Physics Research, Southwest Institute of Fluid Physics, CAEP, Mianyang 621900, Sichuan, China,State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China,State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China and State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China |
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| Abstract: | The 93W/Ni/QSn4-3 joint was prepared by diffusion bonding at vacuum using pure nickel foil as interface layer. The microstructure and composition were characterized by SEM and EP-MA. The tensile strength of joint was also measured. The test results show that Ni foil improves the tensile strength of 93W/Ni/QSn4-3 joint. The thickness of Ni interlayer becomes thiner obviously because of the diffusion layer between Ni element of Ni foil and W and additional elements of 93W alloy, as well as the gradient layer of Ni and Cu elements. Solution reactions between Ni element of Ni foil and Cu element of QSn4-3 alloy, W and additional elements of 93W alloy achieve the joint of 93W/Ni/QSn4-3, that is why tensile strength of 93W/Ni/QSn4-3 joint welded is improved. |
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| Keywords: | diffusion bonding tungsten alloy tin-bronze (QSn4-3) nickel foil |
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