| 锌基合金钎焊界面区的反应机制及组织结构 |
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| 引用本文： | 刘秀忠,杨敏,刘性红.锌基合金钎焊界面区的反应机制及组织结构[J].焊接学报,2009,30(11):89-92. |
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| 作者姓名： | 刘秀忠 杨敏 刘性红 |
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| 作者单位： | 1. 山东大学,材料液态结构及其遗传性教育部重点实验室,济南,250061;山东大学,材料科学与工程学院,济南,250061
2. 象山同家铸造模具厂,浙江,象山,315700 |
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| 摘 要： | 采用XRD,EPMA,TEM和SEM等分析测试手段,对用自行研制的钎料和钎剂钎焊的锌基合金钎焊接头界面区微区成分、组织精细结构及物相等进行了分析.结果表明,钎焊接头界面区主要有扩散区和溶解区组成,扩散区中含有较多镉基固溶体(1.44%Zn),溶解区内含有较多的锌基固溶体,整个界面区主要由镉、锡、锌、铝基固溶体及一些氧化物SnO,SnO_2,CdO和金属化合物MgZn,Mg_2Sn,Al_4Cu_9, Mg_2Cu_6Al_5等组成,未发现对钎焊接头性能有严重不利影响的连续状金属化合物层.Abstract：The micro-region compositisions, fine mierostructure and phases of interface region in joint soldered with new solder and flux self-developed were studied by means of XRD, EPMA, TEM and SEM. The results show that the interface region mainly consists of diffusion zone and dissolution zone. There was more Cd based sohd solution (1.44 % Zn) in diffusion zone, while mere Zn based sohd solution in dissolution zone. The interface region mainly consists of Cd, Sn, Zn, Al sohd solution, and oxides such as SnO, SnO_2, CdO and metallic compounds such as MgZn, Mg_2 Sn, Al_4 Cu_9 and Mg_2 Cu_6 Al_5. No continuous intermetallic compounds layer which would seriously impair the properties of the soldered joint is found.
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| 关 键 词： | 锌基合金 界面区 反应机制 组织结构 |
| 收稿时间： | 2009/3/4 0:00:00 |
Reaction mechanism and microstructure of interface in soldered joint of zinc-based alloy |
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| LIU Xiuzhong,YANG Min and LIU Xinghong.Reaction mechanism and microstructure of interface in soldered joint of zinc-based alloy[J].Transactions of The China Welding Institution,2009,30(11):89-92. |
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| Authors: | LIU Xiuzhong YANG Min and LIU Xinghong |
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| Affiliation: | Key Laboratory of Liquid Structure and Heredity of Materials(Ministry of Education), Shandong University, Jinan 250061, China;School of Materials Science and Engineering, Shandong University, Jinan 250061, China,Key Laboratory of Liquid Structure and Heredity of Materials(Ministry of Education), Shandong University, Jinan 250061, China;School of Materials Science and Engineering, Shandong University, Jinan 250061, China and Xiangshan Tongjia Foundry-die Plant, Xiangshan 315700, Zhejiang, China |
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| Abstract: | The micro-region compositisions, fine mierostructure and phases of interface region in joint soldered with new solder and flux self-developed were studied by means of XRD, EPMA, TEM and SEM. The results show that the interface region mainly consists of diffusion zone and dissolution zone. There was more Cd based sohd solution (1.44 % Zn) in diffusion zone, while mere Zn based sohd solution in dissolution zone. The interface region mainly consists of Cd, Sn, Zn, Al sohd solution, and oxides such as SnO, SnO_2, CdO and metallic compounds such as MgZn, Mg_2 Sn, Al_4 Cu_9 and Mg_2 Cu_6 Al_5. No continuous intermetallic compounds layer which would seriously impair the properties of the soldered joint is found. |
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| Keywords: | Zn based alloy interfacial zone reaction mechanism microstructure |
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