| 微连接接头在热疲劳过程中的破坏规律 |
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| 引用本文： | 林健,雷永平,赵海燕,吴中伟.微连接接头在热疲劳过程中的破坏规律[J].焊接学报,2009,30(11):65-68,72. |
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| 作者姓名： | 林健 雷永平 赵海燕 吴中伟 |
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| 作者单位： | 1. 北京工业大学材料学院,北京,100124
2. 清华大学机械工程系,北京,100084 |
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| 基金项目： | 北京市属市管高校人才强教计划，现代焊接生产技术国家重点实验室开放课题研究基金 |
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| 摘 要： | 同时采用电阻测量方法和疲劳裂纹观测方法分析表面贴装结构焊点的热疲劳破坏过程.通过研究焊点在热疲劳过程中的电阻值变化和热疲劳裂纹的扩展过程,来比较传统锡铅钎料焊点和无铅钎料SAC305焊点的热疲劳破坏规律.并结合有限元分析,研究焊点在热疲劳过程中的电阻值变化与裂纹扩展之间的关系,从而获得一种工程上较为实用的焊点热疲劳失效的电阻值经验判据.结果表明,SAC305无铅钎料焊点相对于传统锡铅钎料焊点而言,具有较为优异的抗热疲劳性能.根据试验研究和有限元分析结果建立了焊点在热疲劳过程中发生失效的电阻值经验判据.Abstract：The failure process of soldered joint in SMT was investigated by electrical resistance measurement method and crack observation method. The characteristics of electrical resistance value variation of lead-tin and lead-free soldered (SA(305) joints during the thermal fatigue test were obtained. And at the same time the crack propagation in soldered joint was observed. According to these measurements, the failure roles of lead-tin and lead-free soldered joint were compared. The relationship between electrical resistance value variation and crack propagation of soldered joint during thermal fatigue test was studied by FEM, and an empirical criterion to estimate the failure of the soldered joint in the thermal fatigue test was obtained based on electrical resistance value variation. The experimental results show that the lead-free soldered joint has a higher resistibility in therrnal fatigue than the traditional lead-tin soldered joint. The criterion based on electrical resistance value variation was founded from the experimental and simulation results.
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| 关 键 词： | 表面贴装结构 微连接接头 热疲劳 电阻值 疲劳裂纹 |
| 收稿时间： | 2009/7/7 0:00:00 |
Failure of soldered joint during thermal fatigue test |
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| LIN Jian,LEI Yongping,ZHAO Haiyan and WU Zhongwei.Failure of soldered joint during thermal fatigue test[J].Transactions of The China Welding Institution,2009,30(11):65-68,72. |
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| Authors: | LIN Jian LEI Yongping ZHAO Haiyan and WU Zhongwei |
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| Affiliation: | College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China,College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China,Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China and College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China |
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| Abstract: | The failure process of soldered joint in SMT was investigated by electrical resistance measurement method and crack observation method. The characteristics of electrical resistance value variation of lead-tin and lead-free soldered (SA(305) joints during the thermal fatigue test were obtained. And at the same time the crack propagation in soldered joint was observed. According to these measurements, the failure roles of lead-tin and lead-free soldered joint were compared. The relationship between electrical resistance value variation and crack propagation of soldered joint during thermal fatigue test was studied by FEM, and an empirical criterion to estimate the failure of the soldered joint in the thermal fatigue test was obtained based on electrical resistance value variation. The experimental results show that the lead-free soldered joint has a higher resistibility in therrnal fatigue than the traditional lead-tin soldered joint. The criterion based on electrical resistance value variation was founded from the experimental and simulation results. |
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| Keywords: | SMT soldered joint thermal fatigue electrical resistance crack |
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