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等离子喷涂双层热障涂层沉积过程的数值模拟
引用本文:侯平均,王汉功,汪刘应,袁晓静.等离子喷涂双层热障涂层沉积过程的数值模拟[J].焊接学报,2009,30(11):97-100,104.
作者姓名:侯平均  王汉功  汪刘应  袁晓静
作者单位:第二炮兵工程学院501室,西安,710025
摘    要:运用ANSYS1O.O有限元分析软件对等离子喷涂典型双层热障涂层沉积过程的温度和应力变化过程进行了数值模拟.结果表明,喷涂过程中,基体背面温度呈台阶状上升,涂层颗粒的温度大幅度周期波动,涂层颗粒的应力随之大幅度周期波动;喷涂结束后,涂层内的残余应力趋于稳定,x方向的最大拉应力存在于陶瓷层与粘结层结合面的边缘;最大y方向拉应力和层间应力都存在于陶瓷层和粘结层的结合面上.涂层的结合面边缘是应力集中部位,结合面的中部应力分布均匀.陶瓷层表面x方向的最大拉应力为423.7MPa.
Abstract:
Nmnerical simulation was performed by finite element analysis (FEA) to investigate the temperature and stress in a typical duplex thermal barrier coating. During the spraying process, the temperature of the back surface of substrate increases step by step, both the temperature and the stress of the coating fluctuate periodically within a wide range. After the deposition, the specimen was cooled to the room temperature slowly. The stresses become constant values, and the maximum radial tensile stress exists at the interface between the ceramic layer and the bonding layer, and the maximum axial and shear stresses exist at the interface, where is the concentrated stress area. The stresses of the middle interfaces are uniform. The maximum tensile stress on the ceramic layer surface is 423.7 MPa.

关 键 词:数值模拟  等离子喷涂  热障涂层  温度场  残余应力
收稿时间:2008/12/18 0:00:00

Numerical simulation on deposition process of duplex thermal barrier coating by plasma spraying
HOU Pingjun,WANG Hangong,WANG Liuying and YUAN Xiaojing.Numerical simulation on deposition process of duplex thermal barrier coating by plasma spraying[J].Transactions of The China Welding Institution,2009,30(11):97-100,104.
Authors:HOU Pingjun  WANG Hangong  WANG Liuying and YUAN Xiaojing
Affiliation:501 staff, The Second Artillery Engineering College, Xi''an 710025, China,501 staff, The Second Artillery Engineering College, Xi''an 710025, China,501 staff, The Second Artillery Engineering College, Xi''an 710025, China and 501 staff, The Second Artillery Engineering College, Xi''an 710025, China
Abstract:Nmnerical simulation was performed by finite element analysis (FEA) to investigate the temperature and stress in a typical duplex thermal barrier coating. During the spraying process, the temperature of the back surface of substrate increases step by step, both the temperature and the stress of the coating fluctuate periodically within a wide range. After the deposition, the specimen was cooled to the room temperature slowly. The stresses become constant values, and the maximum radial tensile stress exists at the interface between the ceramic layer and the bonding layer, and the maximum axial and shear stresses exist at the interface, where is the concentrated stress area. The stresses of the middle interfaces are uniform. The maximum tensile stress on the ceramic layer surface is 423.7 MPa.
Keywords:numerical simulation  plasma spraying  thermal barrier coatings  temperature field  residual stress
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