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酸性氯化铜液蚀刻化学及蚀刻液再生方法评述
引用本文:王红华,蒋玉思.酸性氯化铜液蚀刻化学及蚀刻液再生方法评述[J].印制电路信息,2008(10):57-60.
作者姓名:王红华  蒋玉思
作者单位:1. 深圳市成辉环保设备有限公司,广东,深圳,518105
2. 广州有色金属研究院,广东,广州,510651
摘    要:为了清洁生产、生态环境和人们健康,研究和开发酸性氯化铜蚀刻液的再生方法及再生设备,已成为当前印制板制造行业污染防治工作的重点。为此,文章首次论述了印制板酸性氯化铜液蚀刻化学及蚀刻液的再生方法,讨论了各种方法的优缺点,进而指出了酸性蚀刻液再生的发展趋势。

关 键 词:印制板  酸性蚀刻液  蚀刻  再生  氧化还原

The Chemistry of Acidic Cupric Chloride Etching Process and Review on Regenerating Methods for Cupric Chloride Etchant
WANG Hong-hua,JIANG Yu-si.The Chemistry of Acidic Cupric Chloride Etching Process and Review on Regenerating Methods for Cupric Chloride Etchant[J].Printed Circuit Information,2008(10):57-60.
Authors:WANG Hong-hua  JIANG Yu-si
Affiliation:WANG Hong-hua1 JIANG Yu-si2
Abstract:Research and development of regenerating methods and equipments for acid cupric chloride etchants, have been stressed in prevention and control of pollution work in the business of printed circuit boards for clean production, ecosystem and people's health. The chemistry of the cupric chloride etching process and regenerating methods of cupric chloride etchants, were firstly reviewed in the paper. The advantages and disadvantages of different methods were discussed, and development trend of cupric chloride etchants was pointed out.
Keywords:PCB  cupric chloride etchant  etching  regeneration  oxidation and reduction
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