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Electronic speckle pattern interferometry on a microscopic scale
Authors:John B. Deaton Jr.  James W. Wagner  Robert S. Rogowski
Affiliation:(1) Analytical Services & Materials, Inc., 107 Research Dr., 23666 Hampton, Virginia;(2) Center for Nondestructive Evaluation, The Johns Hopkins University, 21218 Baltimore, Maryland;(3) Nondestructive Evaluation Sciences Branch, NASA Langley Research Center, MS 231, 23681 Hampton, Virginia
Abstract:An electronic speckle pattern interferometer that incorporates a commercial, long-working-distance microscope is described which provides new opportunities to perform nondestructive inspection for applications in fields such as microelectronics. The long-working-distance microscrope was attached directly to the CCD camera to form a compact, portable system with a field of view that was variable over several mm in width. Alignment was greatly simplified because the skewed Michelson interferometer configuration used a speckled reference beam imaged from a diffusely reflecting reference surface that was positioned adjacent to the test object. To demonstrate the performance of the micro-ESPI instrument, fringe patterns were recorded for the quasi-static cantilever deflection of a 1 mm-wide interconnect clip from an electronics socket.
Keywords:Electronic speckle pattern interferometry  optical nondestructive evaluation  nondestructive evaluation of microelectronics
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