| 选择性螯合滴定法测定铋 |
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| 引用本文： | 王献科,李玉萍.选择性螯合滴定法测定铋[J].电镀与环保,1997,17(2):25-27. |
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| 作者姓名： | 王献科 李玉萍 |
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| 作者单位： | 兰州东岗镇钢厂!730020 |
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| 摘 要： | 用ＭＳＡ为释放剂，选择性螯合滴定法测定镀层和镀液中铋。用ＥＤＴＡ螯合Ｂｉ＾３＋和其他阳离子，然后加入ＭＳＡ分解Ｂｉ－ＥＤＴＡ螯合物，释放出的ＥＤＴＡ用锌标准溶液返滴定。实验结果表明，各种阳离子都不干扰。该方法已成功地用于测定锡铋铈合金镀层和镀液中的含量。
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| 关 键 词： | 铋 释放剂 螯合滴定法 测定 电镀液 合金镀层 |
Determination of Bismuth with Selective Chelatometic Titration |
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| Wang Xiank & Li Yuping.Determination of Bismuth with Selective Chelatometic Titration[J].Electroplating & Pollution Control,1997,17(2):25-27. |
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| Authors: | Wang Xiank & Li Yuping |
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| Affiliation: | Wang Xiank & Li Yuping |
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| Abstract: | MAS is used as releasing agent for determination of Bi in deposit and plating bath with selective chelatometry. Bi3+ and other canons are chelated by EDTA, MSA then added to decompose Bi-EDTA chelates and released EDTA back-titrated with Zn2+ standard solution. Experimental results show no interference from various canons. This method has been successfully applied to determination of Bi content in Sn-Bi-Ce deposit and plating bath. |
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| Keywords: | Bismuth Releasing agent Selective chelatometry Determination |
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