| 离子液体电沉积铜及其合金的研究现状 |
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| 引用本文： | 杨坤,华一新.离子液体电沉积铜及其合金的研究现状[J].冶金丛刊,2007(4):40-45. |
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| 作者姓名： | 杨坤 华一新 |
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| 作者单位： | 昆明理工大学材料与冶金工程学院 |
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| 摘 要： | 本文介绍了铜及其合金在离子液体中进行电沉积的研究现状,讨论了铜在吡啶盐类、季铵盐类和咪唑盐类离子液体中进行电沉积的电化学行为,比较了铜在不同离子液体中和不同工作电极上的电沉积机理,分析了离子液体种类对铜电沉积层结构的影响。
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| 关 键 词： | 离子液体 铜 铜合金 电沉积 |
| 文章编号： | 1671-3818（2007）04-0040-06 |
ELECTRODEPOSITION OF COPPER AND ITS ALLOYS IN IONIC LIQUIDS |
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| Yang Kun,Hua Yixin.ELECTRODEPOSITION OF COPPER AND ITS ALLOYS IN IONIC LIQUIDS[J].Metallurgical Collections,2007(4):40-45. |
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| Authors: | Yang Kun Hua Yixin |
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| Affiliation: | Faculty of Materials and Metallurgical Engineering, Kunming University of Science and Technology |
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| Abstract: | In this paper,the electrodeposition of copper and its alloys from ionic liquids were reviewed.The electrochemical behavior of copper electrodeposition in pyridinium,ammonium and imidazolium ionic liquids was discussed.The mechanisms of copper electrodeposition with different electrodes in various ionic liquids were compared.The influence on structure of deposits was analyzed in various ionic liquids. |
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| Keywords: | ionic liquids copper copper alloys electrodeposition |
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