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激光成型技术在台阶板加工中的应用研究
引用本文:焦云峰,武凤伍,张利华.激光成型技术在台阶板加工中的应用研究[J].印制电路信息,2012(4):28-31.
作者姓名:焦云峰  武凤伍  张利华
作者单位:深南电路有限公司,广东深圳,518117
摘    要:近年来,随着PCB的迅猛发展,PCB的设计也日新月异。对于台阶板的制作,目前业内主要是采用先内层开槽,压合前填充缓冲材料,压合后控深开盖取出缓冲材料的工艺生产。介绍了几种激光成型在台阶板加工中的应用方法,这些方法可以弥补常规方法无法实现的效果,满足有特殊要求的板件制作。

关 键 词:激光成型  台阶板  流胶

Study of laser shape technology on step boards
JIAO Yun-feng,WU Feng-wu,ZHANG LI-hua.Study of laser shape technology on step boards[J].Printed Circuit Information,2012(4):28-31.
Authors:JIAO Yun-feng  WU Feng-wu  ZHANG LI-hua
Affiliation:JIAO Yun-feng WU Feng-wu ZHANG LI-hua
Abstract:In recent years,the PCB design is also changing accordingly with the rapid development of PCB.For the step boards,the production technology in the PCB industrial is cutting the slot and filling the buffer material before the lamination,after lamination using the control depth routing to remove the buffer material.This thesis introduces several kinds of the laser shape which were applied in the manufacturing of the depth boards.This applications and methods can be served as remedy for the normal manufacturing process and also satisfy the manufacturing of the special boards.
Keywords:Laser shape  step boards  resin flow
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