磁控溅射法制备金/钆柱腔工艺研究

采用直流磁控溅射方法制备金/钆(Au/Gd)多层膜，并研究不同制备参数对多层膜结构与性能的影响。溅射压强高于1Pa时，Au膜与Gd膜的沉积速率均随溅射压强的增大而下降；在较低溅射气压下，随着溅射气压的降低，金膜与钆膜的均方根粗糙度有所减小；随着溅射功率的减小，金/钆多层膜的周期性结构变好，界面更为清晰。本工作制备了不同原子比的金/钆膜柱腔，探讨了有关柱腔成型的解决方法。

Fabrication Technique of Au/Gd hohiraum by Magnetron Sputtering

The Au/Gd multilayer films were prepared by magnetron sputtering. The effects of the technique parameters on the structure and properties of Au/Gd multilayer films were studied. The results show that the deposition rates of Au and Gd films decrease with increase of the sputtering pressure. At low pressure, the RMS roughnesses of Au and Gd films decrease with decrease of the sputtering pressure. The period structures of Au/Gd multilayer films are clearer at lower sputtering power. Based on the preparations of Au/Gd multilayer films, the Au/Gd hohlraum were fabricated. The effects of Au/Gd ratio on the mechanical properties of the Au/Gd hohlraum were investigated.