| 浅谈等离子在印制电路板中的应用 |
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| 引用本文： | 信峰. 浅谈等离子在印制电路板中的应用[J]. 印制电路信息, 2012, 0(10): 42-43 |
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| 作者姓名： | 信峰 |
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| 作者单位： | 博敏电子股份有限公司 |
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| 摘 要： | 从等离子清洗的原理入手,简介了其在印制电路板制造过程中的应用包括孔清洗、表面活化、去残留物等。从等离子处理前后表面能的变化角度提出了利用接触角对等离子清洗效果进行定量评价,综述了常用的接触角测量方法。
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| 关 键 词： | 等离子清洗 印制电路板 接触角 |
The application of plasma in printed circuit board |
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| XIN Feng. The application of plasma in printed circuit board[J]. Printed Circuit Information, 2012, 0(10): 42-43 |
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| Authors: | XIN Feng |
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| Abstract: | Based on the principle of the plasma cleaning,this paper introduced the application of plasma in the printed circuit board manufacturing process including hole cleaning,the application of surface activation,to remove residue,etc.From the surface change after plasma treatment,the contact angle is used to evaluate plasma clean effect.The general used contact angle measurement method is also reviewed. |
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| Keywords: | plasma cleaning printed circuit board contact angle |
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