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Ce对Sn-Ag-Cu系焊料合金的组织与性能影响
引用本文:赵小艳,赵麦群,王娅辉,顾琳,葛利玲. Ce对Sn-Ag-Cu系焊料合金的组织与性能影响[J]. 电子元件与材料, 2006, 25(6): 27-29
作者姓名:赵小艳  赵麦群  王娅辉  顾琳  葛利玲
作者单位:西安理工大学材料科学与工程学院,陕西,西安,710048;西安理工大学材料科学与工程学院,陕西,西安,710048;西安理工大学材料科学与工程学院,陕西,西安,710048;西安理工大学材料科学与工程学院,陕西,西安,710048;西安理工大学材料科学与工程学院,陕西,西安,710048
摘    要:通过添加稀土Ce研究了Sn-3.0Ag-2.8Cu系焊料合金的显微组织和性能。用光学显微镜、SEM、EDX对其显微组织进行分析,并且对其导电性,润湿性,硬度等重要性能进行测试。结果表明,添加稀土w(Ce)为1%焊料合金的导电性明显提高;而润湿角明显减小,润湿性增强;同时焊料合金的硬度也有所增加。

关 键 词:金属材料  无铅焊料  稀土Ce  导电性  润湿性
文章编号:1001-2028(2006)06-0027-03
收稿时间:2005-12-13
修稿时间:2005-12-13

Effect of Ce on Microstructure and Properties of Sn-Ag-Cu Solder Alloys
ZHAO Xiao-yan,ZHAO Mai-qun,WANG Ya-hui,GU Lin,GE Li-ling. Effect of Ce on Microstructure and Properties of Sn-Ag-Cu Solder Alloys[J]. Electronic Components & Materials, 2006, 25(6): 27-29
Authors:ZHAO Xiao-yan  ZHAO Mai-qun  WANG Ya-hui  GU Lin  GE Li-ling
Abstract:The Sn-3.0Ag-2.8Cu solder of addition micro-vadable-Ce was studied. The microstructure was observed by means of optical microscopy, SEM and EDX, and some important properties as conductivity property, wetting property and rigidity were tested. The results show that conductivity property of addition ce solder alloy is enhanced obviously; the contact angle can be reduced clearly; the rigidity of solder alloy is also increased.
Keywords:metallic materials   lead-free solder   rare earth Ce   conductivity property   wetting property
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