颗粒增强Sn-Ag基无铅复合钎料显微组织与性能

通过外加法向Sn-3.5Ag焊料中加入体积分数为10%的微米级Cu、Ni颗粒制备了无铅复合钎料,对钎料的显微组织、拉剪及润湿性能进行了研究。结果表明,颗粒周围以及基板界面处的显微组织中生成了金属间化合物,其形态及大小因加入颗粒而不同。颗粒的加入提高了钎料钎焊接头的剪切强度,其中Cu颗粒增强的接头的剪切强度提高了33%,Ni颗粒的提高了20%。两种复合钎料的铺展面积均下降了约15%,其中Cu颗粒增强复合钎料润湿角由11°增加到18°。

Microstructure and properties of particle reinforced Sn-Ag based lead-free composite solders

Composite solders were fabricated by mechanically mixing the Sn-3.5Ag solder paste with micron scale of 10 %(volume fraction) Cu and Ni particles.Microstructure,shear strengths,and wetting property were investigated.The results show that the morphology and dimension of intermetallic compound(IMC) at the Cu substrate-solder interface and around the reinforcement particles varied with different Cu and Ni additions.Shear strengths of Cu particle reinforced composite solder joints increase approximately 33 %,while the Ni particle reinforced composite solder joints increase about 20 %.Spreading area of composite solders decrease about 15 %.The wetting angle of Cu particle reinforce composite solder increase from 11° to 18°.