| 微机电系统封装技术 |
| |
| 引用本文： | 潘开林,李鹏,宁叶香,颜毅林.微机电系统封装技术[J].微细加工技术,2008(1). |
| |
| 作者姓名： | 潘开林 李鹏 宁叶香 颜毅林 |
| |
| 作者单位： | 桂林电子科技大学,机电工程学院,广西桂林,541004 |
| |
| 摘 要： | 首先提出了MEMS封装技术的一些基本要求,包括低应力、高真空、高气密性、高隔离度等,随后简要介绍了MEMS封装技术的分类.在此基础上,综述了三个微机电系统封装的关键技术:微盖封装、圆片级芯片尺寸封装和近气密封装,并介绍了其封装结构和工艺流程.
|
| 关 键 词： | 微机电系统封装 微盖封装 圆片级芯片尺寸封装 近气密封装 微机电系统 封装技术 Technology Packaging 工艺流程 封装结构 气密封装 圆片级芯片尺寸封装 系统封装 技术的分类 高隔离度 气密性 高真空 低应力 MEMS |
MEMS Packaging Technology |
| |
| PAN Kai-lin,LI Peng,NING Ye-xiang,YAN Yi-lin.MEMS Packaging Technology[J].Microfabrication Technology,2008(1). |
| |
| Authors: | PAN Kai-lin LI Peng NING Ye-xiang YAN Yi-lin |
| |
| Affiliation: | PAN Kai-lin,LI Peng,NING Ye-xiang,YAN Yi-lin(School of Mechanical & Electronical Engineering,Guilin University of Electronic Technology,Guilin 541004,China) |
| |
| Abstract: | The micro-electromechanical system packaging technology plays one of the most important roles in the application of MEMS.Compared with advanced microelectronics packaging technology,more challenges in MEMS packaging have to be faced.Some basic requirements of MEMS packaging technology,such as the low-stress,high-vacuum,high air-sealed and high-isolation,and so on were summarized firstly,and then classifications of MEMS packaging were introduced briefly.Three key types of MEMS packaging technologies,includin... |
| |
| Keywords: | micro electromechanical system packaging cap-on-chip packaging wafer-level chip scale packaging near-hermetic package |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
