| 塑封材料研究进展 |
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| 引用本文： | 武祥. 塑封材料研究进展[J]. 电子工业专用设备, 2012, 41(9): 1-7,30 |
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| 作者姓名： | 武祥 |
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| 作者单位： | 中国电子科技集团公司,北京,100846 |
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| 摘 要： | 综述了常用塑封树脂和塑封填充材料的最新进展,概述了常用塑封树脂和塑封填充材料的应用特征,讨论了需要关注的重点方向。
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| 关 键 词： | 塑封树脂 塑封填充料 综述 |
The Research Progress On Plastic Packaging Material |
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| WU Xiang. The Research Progress On Plastic Packaging Material[J]. Equipment for Electronic Products Marufacturing, 2012, 41(9): 1-7,30 |
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| Authors: | WU Xiang |
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| Affiliation: | WU Xiang(China Electronics Technology Group Corporation,Beijing 100846) |
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| Abstract: | The recent progress for Plastic Packaging Material technology is introduced.The structure,properties and application of Plastic Packaging Material are investigated.Plastic Packaging Material and its process features are reviewed. |
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| Keywords: | Plastic Packaging research progress |
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