空气氧化—氨浸出废旧电路板中的铜

提出了在氨水—硫酸铵体系下鼓入空气浸出废旧电路板中铜的新工艺。考察了氨水浓度、硫酸铵浓度、固液比、反应温度、通入空气流量和浸出时间对铜浸出率的影响。结果表明,在下述最佳浸出条件下,渣计铜浸出率达到96.67%:氨水浓度2mol/L,硫酸铵浓度2mol/L,固液比1∶20,反应温度25℃、通入空气量8m3/h、浸出时间4h。

Ammonia-Ammonium Sulfate Copper Leaching from Waste Printed Circuit Boards

A novel hydrometallurgical process of copper recovery from waste printed circuit boards was introduced.In this process,air was blown into solution as oxidant for copper leaching in NH3-(NH4)2SO4-H2O system,while leaching residue was treated by physical method.The effects of ammonia and ammonium sulfate concentration,ratio of solid to liquid,leaching temperature,air flow and leaching time on copper leaching rate were investigated.The results show that copper leaching rate is up to 96.67% under the following optimum conditions including ammonia concentration of 2 mol/L,ammonium sulfate concentration of 2 mol/L,ratio of solid to liquid of 1∶20,leaching temperature of 25 ℃,air flow of 8 m3/h and leaching time of 4 h.