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Dendritic growth of undercooled nickel-tin: Part I
Authors:Y Wu  T J Piccone  Y Shiohara  M C Flemings
Affiliation:(1) Department of Materials Science and Engineering, Massachusetts Institute of Technology, 02139 Cambridge, MA;(2) Materials Processing Center, Massachusetts Institute of Technology, 02139 Cambridge, MA;(3) Castings Research Laboratory of Waseda University, Tokyo, Japan
Abstract:Solidification of undercooled Ni-25 wt pct Sn alloy was observed by high-speed cinematography and results compared with optical temperature measurements. Samples studied were rectangular in cross-section, and were encased in glass. Cinematographic measurements were carried out on samples undercooled from 68 to 146 K. These undercoolings compare with a temperature range of 199 K from the equilibrium liquidus to the extrapolated equilibrium solidus. At all undercoolings studied, the high-speed photography revealed that solidification during the period of recalescence took place with a dendrite-like front moving across the sample surface. Spacings of the apparent “dendrite” were on the order of millimeters. The growth front moved at measured velocities ranging from 0.07 meters per second at 68 K undercooling to 0.74 meters per second at 146 K undercooling. These velocities agree well with results of calculations according to the model for dendrite growth of Lipton, Kurz, and Trivedi. It is concluded that the coarse structure observed comprises an array of very much finer, solute-controlled dendrites.
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