| 二甲基亚砜中半导体上脉冲电沉积Bi薄膜 |
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| 引用本文： | 袁定胜,潘文杰,刘冠昆,刘鹏,童叶翔.二甲基亚砜中半导体上脉冲电沉积Bi薄膜[J].材料保护,2003,36(5):38-39. |
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| 作者姓名： | 袁定胜 潘文杰 刘冠昆 刘鹏 童叶翔 |
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| 作者单位： | 中山大学化学与化学工程学院,广东,广州,510275 |
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| 基金项目： | 中山大学校科研和教改项目，， |
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| 摘 要： | 从原有的化学镀铜的工业配方出发，对其用量进行改良，特别是镀液的pH值调试，配体的使用和还原剂的用量，在硅片上沉积出一层光亮而且致密的铜薄膜。结果表明，在二甲基亚砜中硅铜基体上的电沉积铋薄膜均匀、致密、粘附力强，XRD测试表明铋以晶体析出。
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| 关 键 词： | 化学镀 电沉积 铋 |
| 文章编号： | 1001-1560(2003)05-0038-02 |
Pulse Electrodepositing Bismuth Film on the Silicon |
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| YUAN Ding-sheng,PAN Wen-jie,LIU Guan-kun,LIU Peng,TONG Ye-xiang.Pulse Electrodepositing Bismuth Film on the Silicon[J].Journal of Materials Protection,2003,36(5):38-39. |
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| Authors: | YUAN Ding-sheng PAN Wen-jie LIU Guan-kun LIU Peng TONG Ye-xiang |
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| Abstract: | First industrial formula of electroless copper plating was improved to obtain a bright and compact copper film on the silicon slice, especially for the pH value, complexing agent and reductant. Later bismuth film was elec-trodeposited on the silicon/copper substrate in a non-aqueous solution. Results showed that the bismuth film was uni-form and compact and good adhesion to matrix, and the bismuth was granule form. |
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| Keywords: | electroless plating electrodeposition bismuth |
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