| 靶材钎焊连接质量的超声成像检测技术 |
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| 引用本文： | 陈振华,史耀武. 靶材钎焊连接质量的超声成像检测技术[J]. 无损检测, 2007, 29(5): 244-246 |
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| 作者姓名： | 陈振华 史耀武 |
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| 作者单位： | 北京工业大学,材料科学与工程学院,先进材料加工技术研究所,北京,100022 |
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| 摘 要： | 采用超声成像方法对微电子器件镀膜靶材钎焊质量进行检测,获得其A扫描和C扫描图像。根据扫描图像判断缺陷的大小、种类及位置,并通过断面金相分析进行验证。试验表明,超声成像检测方法能够高效、快速、全面地反映出钎焊界面的接合状态及内部缺陷,是一种较好的检测钎焊靶材连接质量的无损检测方法。
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| 关 键 词： | 超声成像检测 靶材 钎焊 连接质量评估 |
| 文章编号： | 1000-6656（2007）05-0244-03 |
| 收稿时间： | 2005-11-29 |
| 修稿时间： | 2005-11-29 |
Ultrasonic Imaging Technique on Joining Quality of Target Assembly |
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| CHEN Zhen-hua,SHI Yao-wu. Ultrasonic Imaging Technique on Joining Quality of Target Assembly[J]. Nondestructive Testing, 2007, 29(5): 244-246 |
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| Authors: | CHEN Zhen-hua SHI Yao-wu |
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| Affiliation: | Institute of Advanced Materials Processing Technology, School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China |
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| Abstract: | Ultrasonic imaging technique was adopted to evaluate the joining quality of a target assembly used in microelectronic technology.Dimension,location and variety of defects were determined by its A-scan and C-scan images.Then the testing results were proved by metallographic analysis.Testing results showed that the ultrasonic imaging technique could be used to evaluate the joint state and interior defects,and it is a good nondestructive testing method for the joining quality evaluation of target assembly. |
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| Keywords: | Ultrasonic imaging technique Target assembly Solder Joining quality evaluation |
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