Reliability evaluation of adhesive bonded SMT components in industrial applications |
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| Authors: | M. G. P richaud, J. Y. Del tage, H. Fr mont, Y. Danto,C. Faure |
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| Affiliation: | a IXL, UMR 5818, 351 Cours de la Libération, 33405 Talence Cédex, France;b SOLECTRON, BP33611 Cestas Cédex, France |
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| Abstract: | This paper compares the efficiency of two thermosetting and one thermoplastic conductive adhesives for surface mount technology (SMT) assemblies. Their reliability is evaluated during accelerated life tests through electrical and mechanical measurements. Contact metallizations are taken into account. Finite element simulations confirm the experimental results, and a parametric study permits us to define some choice criteria for the physical properties of adhesives. |
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