| InSb薄膜磨抛工艺技术的研究 |
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| 引用本文： | 孔海霞 于成民. InSb薄膜磨抛工艺技术的研究[J]. 仪表技术与传感器, 1998, 0(10): 13-15 |
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| 作者姓名： | 孔海霞 于成民 |
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| 作者单位： | 沈阳仪器仪表工艺研究所 |
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| 摘 要： | 】在ＩｎＳｂ薄膜制备过程中，用机械磨抛的方法，探索了Ｉｎ２Ｏ３氧化膜的去除和ＩｎＳｂ敏感膜层的减薄、抛光等技术问题，从而提出一种新型磨抛工艺。文章介绍了该工艺的基本原理及不同工艺规范的磨抛结果。
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| 关 键 词： | InSb薄膜 磨抛工艺 补偿技术 |
A Study of Process Techniques for InSb Thin Film Abrading and Polishing |
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| Kong Haixia,Yu Chengmin,Sun Rentao,Liu Peiyao Shenyang Institute of Instrumentation Technology,Shenyang. A Study of Process Techniques for InSb Thin Film Abrading and Polishing[J]. Instrument Technique and Sensor, 1998, 0(10): 13-15 |
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| Authors: | Kong Haixia Yu Chengmin Sun Rentao Liu Peiyao Shenyang Institute of Instrumentation Technology Shenyang |
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| Affiliation: | Kong Haixia,Yu Chengmin,Sun Rentao,Liu Peiyao Shenyang Institute of Instrumentation Technology,Shenyang 110043 |
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| Abstract: | This paper has investigated the technological problems such as the removing In 2O 3 film lager and thinning and polishing the InSb sensitive film lager by means of mechanical abrading and polishing during the preparation of the InSb thin film and introduced a novel abrading and polishing processing.The basic principle of this technology and the abrading and polishing results of different work programs are described in this paper. |
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| Keywords: | InSb Thin Film Polishing Processing Compesnation techniques. |
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