| 一种表面可动微结构的释放新工艺 |
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| 引用本文： | 沈绍群 Beni.,MA. 一种表面可动微结构的释放新工艺[J]. 仪表技术与传感器, 1998, 0(7): 10-11,14 |
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| 作者姓名： | 沈绍群 Beni. MA |
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| 作者单位： | [1]复旦大学传感器研究室 [2]西班牙国家微电子中心 |
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| 摘 要： | 在表面微机械加工技术中，当牺牲层腐蚀后，已被释放的表面可动微结构会粘结在衬底上使器件失效。
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| 关 键 词： | 表面微机械 防黏附 传感器 微机械 |
A Novel Releasing Technology of the Surface Movable Microstructure |
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| Shen Shaoqun Bao Minhang STL of Fudan University,Shanghai . M.A.Beniteg J.Esteve State Microelectronics Centere of Spain. A Novel Releasing Technology of the Surface Movable Microstructure[J]. Instrument Technique and Sensor, 1998, 0(7): 10-11,14 |
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| Authors: | Shen Shaoqun Bao Minhang STL of Fudan University Shanghai . M.A.Beniteg J.Esteve State Microelectronics Centere of Spain |
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| Affiliation: | Shen Shaoqun Bao Minhang STL of Fudan University,Shanghai 200233. M.A.Beniteg J.Esteve State Microelectronics Centere of Spain |
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| Abstract: | In the surface micromachining technology,the released surface movable microstracture can be bonded on the substrare after etching of scraficed lager and lead to device failave,Under normal coudition the etching of the scraficed layer is the last working process of the manufacturing the device,also the surface protection of the CMOS-Circait is rery difficult.In this paper a novel releasing technology of the surface movable microstracture is provided.It can avoid this kind phenomenon. |
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| Keywords: | Surface Micromachiaing Anti-Adhesion Sensor |
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