Numerical simulation and analysis of thermal stress distributions for a planar solid oxide fuel cell stack with external manifold structure

A three-dimensional numerical model based on the finite element method (FEM) is constructed to calculate the thermal stress distribution in a planar solid oxide fuel cell (SOFC) stack with external manifold structure. The stack is composed of 5 units which include cell, metallic interconnect, seal and anode/cathode current collectors. The temperature profile is described according to measured temperature points in the stack. It can be clearly seen that the maximum stress concentration area appears at the corner of the components when the stack is heated from room temperature (RT) to 780 °C. The effects of stack components on maximum stress concentration have been investigated under the operation temperature, as well as the thermal stress simulation results. It is obvious that the coefficient of thermal expansion (CTE) mismatch between the interconnect and the seal plays an important role in determining the thermal stress distribution in the stack. However, different compressive loads have almost no effect on stress distribution, and the influence of glass-based seal depends on the elastic modulus. The simulation results can be applied for optimizing the structural design of the stack and minimizing the high stress concentration in components.