Fracture of Sn-3.5%Ag solder alloy under creep |
| |
| Authors: | V I Igoshev J I Kleiman D Shangguan S Wong U Michon |
| |
| Affiliation: | (1) Integrity Testing Laboratory Inc., 80 Esna Park Drive, Units 7-9, L3R 2R7 Markham, Ontario, Canada;(2) Visteon Automotive Systems, 48121 Deaborn, MI, USA;(3) Visteon Automotive Systems, Markham, ON, Canada;(4) ESPEO.3, Universite D’Orleans, France |
| |
| Abstract: | Experimental data on the creep and failure of the Sn-3.0%Ag, Sn-3.5%Ag, and Sn-4.0%Ag lead free solder alloys are described.
Further development of the alloys’ failure micromechanism, proposed earlier, is presented. Possible ways of improving the
mechanical properties of Sn-Ag-based solder alloys are discussed. |
| |
| Keywords: | Crack nucleation and propagation microstructure creep deformation |
| 本文献已被 SpringerLink 等数据库收录！ |
|
