GH4169高温合金的压缩结合行为及界面组织演变

为了模拟高温合金GH4169的热轧复合工艺，采用MSS-200热模拟机对高温合金GH4169进行热压缩复合模拟，变形温度为900~1100 ℃，应变速率为1~10 s^-1。通过应力应变曲线建立了描述GH4169高温合金压缩变形行为的Arrhenius型本构方程和热加工图，计算相应的热变形活化能Q和应力指数n分别为320.33 kJ·mol^-1和4.1573。此外，采用光学显微镜（OM）和电子背散射衍射（EBSD）技术观察了结合界面。结果表明：结合界面主要受变形工艺参数的影响，在1100 ℃/10 s^-1变形条件时，结合界面几乎看不见。

Compression Bonding Behavior and Interfacial Microstructural Evolution of GH4169 Superalloy

In order to simulate the hot-rolling composite technology of GH4169 superalloy, the hot isothermal compression bonding tests were performed on an MSS-200 thermal simulator in the temperature range of 900 °C to 1100 °C and at strain rates of 1~10 s^-1. The Arrhenius type constitutive equation and the hot processing map were established to describe the deformation behavior of GH4169 superalloy during the compression bonding. Furthermore, the corresponding thermal deformation activation energy Q and the stress index n were calculated as 320.33 kJ^·mol^-1 and 4.1573, respectively. Additionally, the bonding interfaces were observed by optical microscope (OM) and electron backscatter diffraction (EBSD) technique. The results show that the bonding interface is mainly affected by the technological parameters, and the bonding interface becomes almost invisible at 1100 °C with a rate of 10 s^-1.