| 先进芯片封装技术 |
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| 引用本文： | 鲜飞. 先进芯片封装技术[J]. 印制电路信息, 2003, 0(7): 58-61 |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,430074 |
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| 摘 要： | 微电子技术的飞速发展也同时推动了新型芯片封装技术的研究和开发。本文主要介绍了几种新型芯片封装技术的特点,并对未来的发展趋势及方向进行了初步分析。
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| 关 键 词： | 芯片 封装 BGA CSP COB flip chip MCM |
| 修稿时间： | 2003-06-03 |
The Advanced Chip Package Technology |
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| Xian Fei. The Advanced Chip Package Technology[J]. Printed Circuit Information, 2003, 0(7): 58-61 |
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| Authors: | Xian Fei |
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| Abstract: | The rapid development of microelectronic technology has been giving impetus to the development of new chip package technology. Characteristics of several advanced chip package technology are introduced in the paper. The up-to-date trends are discussed and the future research directions are suggested. |
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| Keywords: | chip package BGA CSP COB flip chip MCM |
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