超薄圆片划片工艺探讨

集成电路小型化正在推动圆片向更薄的方向发展，超薄圆片的划片技术作为集成电路封装小型化的关键基础工艺技术，显得越来越重要，它直接影响产品质量和寿命。本文从超薄片划片时常见的崩裂问题出发，分析了崩裂原因，简单介绍了目前超薄圆片切割普遍采用的STEP切割工艺。另外，针对崩裂原因，还从组成划片刀的3个要素入手分析了减少崩裂的选刀方法。

Study on the Technology of the Ultrathin Wafer Sawing

The trend of small outline IC is leading to thinner wafer development. The ultrathin wafer sawing technology, which is the key and basic technology to small outline IC, is becoming more and more important, as it directly affects the product quality and reliability. This article focuses on the usual problem of die chip and crack in ultrathin wafer sawing, analyses the defect causes, and briefly introduces the step sawing technology which is widely used in current ultrathin wafer sawing. Besides, it analyses ...