| Affiliation: | 1. Department of Materials Science and Engineering, Center for Bio‐Integrated Electronics, Simpson Querrey Institute for Nano/Biotechnology, Northwestern University, Evanston, IL, USA;2. AML Department of Engineering Mechanics, Interdisciplinary Research Center for Flexible Electronics Technology, Tsinghua University, Beijing, P. R. China;3. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana‐Champaign, Urbana, IL, USA;4. Center for Bio‐Integrated Electronics, Northwestern University, Evanston, IL, USA;5. Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA;6. Department of Dermatology, Feinberg School of Medicine, Center for Bio‐Integrated Electronics, Simpson Querrey Institute for Nano/Biotechnology, Northwestern University, Chicago, IL, USA;7. Departments of Civil and Environmental Engineering and Mechanical Engineering, Center for Engineering Health, and Skin Disease Research Center, Northwestern University, Evanston, IL, USA;8. Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, and Neurological Surgery, Center for Bio‐Integrated Electronics, Simpson Querrey Institute for Nano/Biotechnology, McCormick School of Engineering and Feinberg School of Medicine, Northwestern University, Evanston, IL, USA |
