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Ceramic-metal package for high power LED lighting
Authors:Yu Jin HEO    Hyo Tae KIM    Sahn NAHM    Jihoon KIM    Young Joon YOON    Jonghee KIM
Affiliation:1. Korea Institute of Ceramic Engineering and Technology, Seoul 153-801, Korea ;Department of Materials Science and Engineering, Korea University, Seoul 136-701, Korea
2. Korea Institute of Ceramic Engineering and Technology, Seoul 153-801, Korea
3. Department of Materials Science and Engineering, Korea University, Seoul 136-701, Korea
Abstract:
Keywords:light-emitting diodes (LEDs) package  highpower  thick film  heat dissipation  thermal resistance
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