仲氨基笼型倍半硅氧烷改性室温固化环氧树脂的研究

采用直接水解法合成了氨丙基笼型倍半硅氧烷(OapPOSS)。为了改善POSS与环氧树脂的相容性和分散性,在OapPOSS基础上制备了仲氨基笼型倍半硅氧烷(SaPOSS),并将其用于E-51/脂肪胺室温固化环氧树脂改性,研究了SaPOSS对环氧树脂力学性能、玻璃化转变温度、介电性能的影响。结果表明:SaPOSS能显著提高树脂的冲击性能和耐热性,降低介电常数和介电损耗。当SaPOSS加入量为3%时,环氧树脂的冲击强度从原来的20.5kJ/m2,提高到了29.7kJ/m2,玻璃化转变温度从113℃提高到117℃,扫描电镜的观测结果与力学性能的变化趋势相一致。当SaPOSS加入量为5%时,介电损耗从原来的0.035降到了0.024,介电常数也有大幅下降。

The Study on Room Temperature Curing Epoxy Resin Modified by SaPOSS

The octaaminopropyl polyhedral oligomeric silsesquioxane （OapPOSS） was synthesized by hydrolysis method, and the secondary amino substituted polyhedral oligomeric silsesquioxane （SaPOSS） was prepared based on OapPOSS in order to improve the compatibility and dispersion of the POSS in epoxy resin. The synthesized SaPOSS was used to modify the room temperature curing epoxy resin, and the mechanical properties, glass transition temperature and dielectric properties of the modified resin were evaluated. The SaPOSS modified epoxy resins exhibited good mechanical performance, thermal stability and low dielectric loss. The impact strength of the modified resin increased from 20.5kJ/m2 to 29.7 kJ/m2 and the glass transition temperature increased from 113℃ to 117℃ when the SaPOSS content was 3%. The SEM observation results were consistent with the variation trend of the mechanical properties. When 5% SaPOSS was introduced, the dielectric loss tangent decreased from 0.035 to 0.024 and the dielectric constant declined greatly.