| 新一代无铅兼容PCB基板的研究进展 |
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| 引用本文： | 张家亮. 新一代无铅兼容PCB基板的研究进展[J]. 印制电路信息, 2006, 33(6): 26-29 |
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| 作者姓名： | 张家亮 |
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| 作者单位： | 南美覆铜板厂有限公司,广东,佛山,528231 |
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| 摘 要： | 介绍了无铅兼容PCB的两种主要的酚醛树脂固化剂,比较了酚醛固化环氧和双氰胺固化环氧的板材性能,分析了无铅兼容PCB基板的标准。
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| 关 键 词： | 无铅焊料 PCB基板 兼容 新一代 可靠性 绿色 进展 |
Progress of Research in the Next Generation Lead Free Compatible PCB Substrate |
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| Zhang Jialiang. Progress of Research in the Next Generation Lead Free Compatible PCB Substrate[J]. Printed Circuit Information, 2006, 33(6): 26-29 |
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| Authors: | Zhang Jialiang |
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| Affiliation: | Zhang Jialiang |
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| Abstract: | In the paper, two main phenolic cure agent of lead free compatible PCB substrate were introduced. Performance of substrate cured with different curing system was compared. The standard about lead free compatible PCB substrate was analyzed. |
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| Keywords: | lead free solder PCB substrate compatible the next generation reliability green progress |
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